Silicone thermal pad is a gap filler with outstanding conductive performance. The CP series is yet another of Dobon’s enhanced thermal gap-filling materials that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase changing and will not contaminate components.
Silicone grease, commonly known as heat dissipation paste, is made of silicone oil, metal oxide and multiple additives. The thermal gap filler grease used between electronic components such as Semiconductor, IC, CPU, MOS and heatsink. Led Lighting, LCD TV, Telecom device, Wireless Hub, Power supply etc.
Heat-conducting graphite sheet is a new heat-conducting and heat-dissipating material with unique grain orientation and uniform heat conduction along two directions. The laminar structure can be well adapted to any surface, shielding heat sources and components while improving the performance of consumer electronics products.
As a professional Thermal Materials manufacturer in China, Our company not only has the perfect R & D management system, but also has excellent engineering designers and excellent professional managers.Dobon adopts the form of automatic production to rationalize the unit price of products, stabilize the quality to delivery on time for meeting the needs of our customers.
We serve more than 100 countries and regions.
Our thermal solutions service more than 80,000 global users
Thermal Management design and layout order documents daily more than 1000
Our one-stop Thermal Interface Materials has a 96.15% on-time delivery.
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