Thermal Materials Production Process

Thermal Interface Materials Fast Production Process

Thermal interface materials (TIMs) are materials used to conduct heat and transfer the heat generated by a heat source to a heat sink through thermal conduction. TIMs are essential in any application involving heat, and there are various forms of TIMs available, such as thermal grease, thermal pads, thermal silicone sheets, thermal gels, and thermal potting compounds. Additionally, there are also other types of TIMs, such as phase change materials, thermal absorbing materials, thermal graphite sheets, and ceramic thermal pads.
Dobon, the best thermal interface materials manufacturer in China. We have developed a set of system production auxiliary software. The system focuses on the fast production service of multi-variety and small-batch Thermal Interface Materials. You need to tell us your requirements . We will give you a high-quality thermal interface material components, fast delivery and the best service

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102023-06 Heat Conducting Silicone Grease
Heat conducting silicone grease is also called heat conducting paste and heat radiating paste
102023-06 Heat Conducting Silicone Grease
Heat conducting silicone grease is also called heat conducting paste and heat radiating paste
102023-06 Thermal Pad CP Series Introduction
The CP series is yet another of Dobon’s enhanced thermal gap-filling materials that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management.
102023-06 Ensuring Long-term Performance and Reliability in Electronic Devices
Electronic products have high heat and short service life!Effective thermal management is key to ensuring consistent long-term performance and reliability in electronic devices.Proven experience and expertise in creating innovative, active solutions to the most complex thermal management issues.
102023-06 Thermal Conductive Double-sided Adhesive Tape Production
Thermal Conductive Double-sided Adhesive Tape Production. These tapes have extremely strong adhesive strength and low thermal impedance, which can effectively replace thermally conductive silicone grease and mechanical fixation.10+ Years Experience,Contact us for your Request
102023-06 Dobon Production Line Introduction
Dobon as a high-tech enterprise specializing in the research and development, production and sales of heat conduction and heat dissipation, insulation materials, thermal insulation and flame retardant materials, and is a well-known heat conduction management solution provider in China.

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Thermal Interface Materials Quality Control

5 steps

Thermal Interface Materials Production Process

The production process of thermal pad includes the following steps: raw material preparation → plasticizing and mixing → molding vulcanization → trimming and cutting → inspection, etc. The following briefly introduces the production process of thermal conductive silicone film:

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01 Raw material preparation

The thermal conductivity of fillers is closely related not only to the materials themselves but also to the particle size distribution, morphology, interface contact, and internal bonding degree of the thermal conductive filler molecules. Generally, fiber-like or foil-like thermal conductive fillers have better thermal conductivity. " />

02 Plasticizing and mixing

Plasticizing and mixing is a process of silicone processing, which refers to reducing the molecular weight and viscosity of raw rubber by mechanical or chemical methods to improve its plasticity and obtain appropriate fluidity to meet the needs of mixing and further processing." />

03 Molding and vulcanization

To produce a flexible, elastic, and tear-resistant thermal conductive silicone sheet, it is necessary to use a silicone gel that has undergone secondary vulcanization." />

04 Trimming and Cutting

The high-temperature treated thermal conductive silicone sheet needs to be placed for a period of time to cool naturally before being cut into different sizes and specifications, and cannot be cooled rapidly by other means." />

05 Product Inspection

The main items that need to be tested for the finished product include thermal conductivity, temperature resistance range, volume resistivity, voltage resistance, flame resistance, tensile strength, hardness, thickness, etc." />

How does Dobon’s MES system effectively control the materials production process?

The R&D laboratory of Dobon Technology is equipped with high-temperature aging instruments, hot and cold impact testers, thermal conductivity testers, and whiteness testers, which are professionally used in the production of thermal conductive materials for heat dissipation.

Strictly quality controlled, the each raw material from Dobon is strictly quality controlled in accordance with the requirements.
In response to these difficulties in thermal conductive materials production orders, Dobon has developed its own production management system. We are able to guarantee quality delivery, whether for large quantities or for small orders of up to 100.

Our Thermal Team Specializes in The Following Major Areas

Thermal Simulation Analysis – Flotherm Software and Fluke Thermal imaging cameras
Thermal Management - Analyzing the problem, Planning the solution, Finding the suitable products
Thermal Products - Thermal Conductive Grease/ Pads/Tape/Putty/Insulator
1.Dobon Thermal management specialists provide the best service in order to solve your thermal problem with FloTherm Software illustrated as below: Perform thermal analysis, create virtual models, and test design modifications of electronic equipment before physical prototyping
2. Fluke Thermal imaging cameras and other thermal contron system are available to optimize your thermal management and find the right solution with cost-effective materials for your application Thermal Management - Analyzing the problem, Planning the solution, Finding the suitable products
Fluke Thermal imaging cameras
3.Dobon works with customers to solve thermal problem (by FlowTherm), cowork with well known companies who deal with thermal design all over the world.(by 6SigmaET)

What are the Advantages of Our Thermal Conductive Materials Manufacturing Execution System?

Dobon's MES systems not only solve the difficulties of small orders but also enable the components production process to deliver orders quickly.
The advantages of Dobon's MES systems are. Every step of the components production process is checked by specialist equipment. So no matter which part of the process has a problem, it can be detected and solved in time. We can deliver orders within 3 to 7 Days. The improved order delivery time has increased our production turnaround. Not only have we reduced production costs, but the number of orders produced each month has increased significantly.

Why use thermally conductive materials?

Electronic components are prone to failure at high temperatures, resulting in system freezes, and excessive temperature will reduce the service life of electronic products and accelerate the aging speed of products. The heat source in electronic products and machinery equipment is based on power consumption electronic components Device-based, such as chips for mobile phones and CPUs for computers.

Air is a poor conductor of heat. After the equipment generates heat, the heat is not easy to dissipate and accumulate in the equipment, resulting in excessive local temperature and affecting the performance of the equipment.

There is a gap between the cooling device and the heating device, and the heat will be resisted by the air when it is conducted between the two. Therefore, the purpose of using a thermal interface material is to fill the gap between the two and remove the air in the gap, thereby reducing the heat dissipation of the heating device and the cooling device. Indirect contact thermal resistance, thereby increasing the rate of heat transfer.

Why Choose Dobon As Your Thermal Materials Provider

We are a provider of thermal conductive materials and solutions that integrate production, design, research and development, and sales.
With our own production base of 3000 square meters and a staff of over 100 people, we serve 2000 customers.
We have complete equipment and facilities, with automated production and strong mass production capabilities, ensuring quality assurance.
Import high thermal conductivity raw materials, environmentally friendly, with excellent performance.
The quality is first-rate with ISO9001 management system certification and a defect rate controlled within 1%.
Supervised on-site by senior engineers with many years of experience! Strict QC inspection to ensure a shipment rate of over 99% for high-quality products.

What are the classifications of heat dissipation materials for electronic applications?

Thermally conductive materials are generally divided into: thermally conductive silicone pads, ceramic heat sinks, graphite sheets, phase change materials, silicone cloth, etc.
Thermally conductive silicone pad: the base material is silicone, a thermally conductive material synthesized by adding various auxiliary materials and metal oxides, also known as thermally conductive silicone sheet, soft thermal pad, etc.
Thermally conductive double-sided adhesive: Acrylic base material is compounded by adding filled thermally conductive powder and organic silicone to achieve thermal conductivity and insulation.
Ceramic heat sink: The characteristics of this material are high thermal conductivity and high insulation. Generally, high-power equipment will use this thermally conductive material.
Thermally conductive silicone cloth: The base material of this material is glass fiber, and some people call it thermally conductive silicone cloth, tear-resistant silicone cloth, etc. This material has better insulation than cross, the disadvantage is that the thermal conductivity is relatively low
Thermal graphite sheet: This material is a new type of material with high performance. It can dissipate heat in two directions at the same time, so the heat dissipation ratio is uniform.
Phase change material: Phase change material is generally used in electronic devices such as liquid crystal displays. Due to the fluidity of the product when heated, the gap filling performance is also good, and it is a thermally conductive material with high cost performance.

Key parameters of thermal interface material - Thermal conductivity

Heat transfer coefficient (heat transfer Coefficient), also known as heat transfer coefficient (k) in W / mK, thermal conductivity formula k = (Q / t) * L / (A * T), where k is the thermal conductivity, Q is the heat, t is the time, L is the length, A is the area, T is the temperature difference; is used to measure the energy per unit time conduction.
Design of the thermal conductivity of the interface material is the key parameter of the thermal conductivity, select the best performance products are not necessarily necessary, hardness, thickness, heat area is also an important design considerations. When the other parameters are equal, the higher the thermal conductivity represents the more efficient thermal management.
The k-value interval of the thermally conductive interface material:
Low k value: 1 - 3 W / m-k
In k value: 4 -6 W / m-k
High k value: 6 - 12 W / m-k

Production Process

Thermal Interface Materials Fast Production Process

Thermal Interface Materials Quality Control

Thermal Interface Materials Production Process

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